SASAKI TAKAAKI (Total 792 Patents Found)

A method of manufacturing a semiconductor package including a substrate for mounting and fixing a semiconductor ship thereon and a connecting pattern, includes providing the substrate with an elongate opening formed therein, fixing the semiconductor chip with its surface mounted on the substrate and with its electrode ...
La présente invention concerne un dispositif de mémorisation doté d'un dispositif d'enregistrement et d'un contrôleur connecté à ce dispositif d'enregistrement et à un ordinateur. Le contrôleur reçoit une pluralité de sous-blocs obtenus sur la base de la division d'un bloc de données prov...
The malfunction of a vibrator as a drawback of a conventional independent vibrator type portable terminal is obviated. A communication system of a portable communication terminal comprises a portable communication terminal capable of movably communicating with another communication terminal via radio communication with...
A file access system includes a file opening unit which opens a given file within an external storage device when a file opening request is issued by an application program. A determining unit determines whether a given file within the storage device has encrypted data when a reading request is issued by the applicatio...
【課題】キャリパボディのロータを跨ぐ背部における下型と中子との型割り位置を、背部の内周側に置くことにより、中子を小型化・簡素化し、製造コストを低減することができるディスクブレーキ用キャリパボディ、その鋳造型及び製...
A semiconductor package is comprised of a substrate for mounting and fixing a semiconductor element thereon and a connecting pattern. The substrate is provided with a through hall formed therein. The semiconductor element is fixed with its surface where the element is formed being mounted on the substrate and with its ...
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the e...
【課題】放熱性と電磁シールドの効果に優れ、コスト削減と歩留まりの向上が期待できるマルチチップ型の半導体装置を提供する。 【解決手段】半導体チップ11,12は、平面状に形成されたリードフレーム13のダイパッド部13a...
(57)【要約】 【目的】 極めて容易にかつ精度良く親機を基準点へ設 置するとともに、設備の簡略化及び親機の小型・軽量化 を図る。 【構成】 親機11に回動可能に設けられたインデック ステーブル14の回転軸15にアーム16の一...
【課題】ターゲットの着脱の手間を低減小さくする放射性同位元素製造装置を提供する。【解決手段】放射性同位元素製造装置1は、荷電粒子線Bを通過させる照射装置本体部5と、照射装置本体部5に対して近接及び離間する移動が可...
A semiconductor package is comprised of a substrate for mounting and fixing a semiconductor element thereon and a connecting pattern. The substrate is provided with a through hall formed therein. The semiconductor element is fixed with its surface where the element is formed being mounted on the substrate and with its ...
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the e...
Erste bis dritte innere Sperrteile sind an beiden Enden einer inneren Beilagplatte in einer Radialrichtung eines Rotors vorgesehen, um jeweils zu dem Bremsbelag gebogen zu werden. Erste bis dritte äußere Sperrteile sind an beiden Enden einer äußeren Beilagplatte in der Radialrichtung des Rotors vorgesehen, um in de...
L'invention concerne un système conçu pour supprimer un inconvénient des terminaux mobiles du procédé dans lequel un vibrateur séparé classique est utilisé, c'est-à-dire les opérations erronées du vibreur. Le système comprend des terminaux de communication mobiles capables de communiquer avec d'...
【課題】部品構造を簡素化して製作コストを抑え、しかも摩擦パッドに対するウェアインジケータの特段の組み付け作業を要することなく、確実にウェアインジケータを摩擦パッドに取り付けることができるウェアインジケータを備えた...
A composite disc rotor (1) includes a disc main body (2), a coupling bracket (3) and coupling units (4). Each of the coupling units includes a bobbin (16), a clip (17) and a coupling bolt (18). A head part (20) of the bobbin includes a torque receiving portion (22) inserted into a notch (15) formed at the coupling brac...
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the e...
A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to...
A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is hel...
本发明提高一种能够在防止在集合配置的元件分离用沟道结构的最外周部产生裂缝的半导体装置。该半导体装置具备形成在半导体基板的一主面的元件分离用沟道(30)、形成在元件分离用沟道(30)内的绝缘物(120)、被元件分离用沟道(30...
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the e...
A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is hel...
PROBLEM TO BE SOLVED: To reduce a use amount of water and to stably move an inspection head. SOLUTION: A turn ring 24 having a circumferential direction split structure is provided in the periphery of an upper end part of an internal pump casing 7 such that the turn ring 24 is liquid-tightly disposed in a gap G of a pu...
A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to...
PROBLEM TO BE SOLVED: To provide a semiconductor package for three-dimensional mounting wherein higher density mounting is enabled as compared with the conventional BGA type semiconductor package and fabrication is easy. SOLUTION: In this semiconductor package for three-dimensional mounting, its manufacturing met...
PURPOSE: To make it possible to stick a rectangular double side self-adhesive sheet to an article made of a thin plate without causing a three-dimensional distortion with only a two-dimensional distortion by incorporating a specified construction into a double side self-adhesive tape comprising a continuous length tape...
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the e...
A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to...
A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to...
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the e...
A file access system includes a file opening unit (5) which opens a given file within a storage device (10) when a file opening request is issued by an application program (1). A determining unit (6, S44) determines whether a given file within the storage device has encrypted data when a reading request is issued by th...
PURPOSE:To dispense with rails, to shorten a working time by facilitating fitting and removal while meeting various connection nozzles, and also to execute flaw detecting inspection and the like with excellent reproducibility and to improve the precision in inspection. CONSTITUTION:A main frame 22 provided at the oppos...